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TPT HB05
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TPT Franz Hickmann 

TPT

ABOUT TPT  

TPT TECHNICAL PRODUCT TRADE
Is a specialist supplier of bonding equipment for more then 10 years. The company has now developed a line of digital bonders for very precise requirements. The company is located at Karlsfelt (outside Munich) in Germany. 

PRODUCT OVERVIEW 

The line of bonders is unique, since the bonding technology is interchangeable (Model HB12, HB14 and/or HB16) with the H30 option (see datasheet).  TPT designed the bonders with motorized Z and Y-axis (not HB02-05 Series) and make use of the latest digital technology. A number of features are already built-in which normally are offered by other manufactures as an option.

MANUAL BALL & WEDGE BONDER  

SEMI-AUTOMATIC WIRE BONDER 

TPT-HB05 Manual Digital Wedge/Ball/Bump Bonder

HB02, HB04 and HB05
Manual Wire Bonder

TPT HB02, HB04 and HB05 Series of bench top size manual wire bonders are easy to operate for laboratories, pilot and small-scale production. One bondhead for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding mode - no hardware change necessary (HB05). Direct access and simple adjustment to all bond parameters.

TPT HB10 Semi-Automatic Wire Bonder

HB06, HB08 and HB10
Semi-Automatic_Wire_Bonder

TPT HB06, HB08 and HB10 Series of bench top size semi-automatic wire bonders with motorized Z-axis.  One bondhead for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding mode - no hardware change necessary (HB10). Direct access and simple adjustment to all bond parameters.

SEMI-AUTOMATIC WIRE BONDER  

HB16D WIRE BONDER WITH DIE BONDING 

TPT HB16 Semi-Automatic Wire Bonder

HB12, HB14 and HB16
Semi-Automatic_Wire_Bonder

TPT HB12, HB14 and HB16 Series of bench top size semi-automatic wire bonders with both motorized table and Z-axis (bond head), provides the best performer for pilot pre-production runs and small-scale production lines.

The H80 option is making the TPT HB16 to act as well as a "Pick and Place/Die Bonder.

H80 the "Pick and Place" Bonding option for HB16
The H80 option is making the HB16 to act as well as a "Pick and Place/Die Bonder. The option is designed for easy change from wire bonding to die bonding. The system is equipped with fine ratio manipulator. Programmable force and time.

HEAVY WIRE BONDER  

HB30 Heavy Wire Bonder

HB30 Heavy Wire Bonder
The TPT HB30 is a bench top size heavy wire bonder. Excellent for laboratories, pilot and pre-  production, Easy operation with TFT (Touch Panel Operator System). Direct access and simple adjustment to all bond parameters and programs

 

 

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Last modified: 2016-08-22