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Bond Process

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UTHE

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UTHE BOND PROCESS ANALYZER  

Uthe support facilities are located in California, Japan, Singapore and Malaysia. These support facilities are readily available to provide technical assistance, full warranty and non-warranty services.

Uthe's Bond process Analyzer allows users to measure, quantify, and store bonding impedance information. This analyzer captures real-time impedance changes through out the bonding cycle and graphically displays the information to an external computer. Data relating to effectiveness of scheduled preventive maintenance can be developed and analyzed.

OPTIONS  
bullet QIA module for frequency spectrum analysis
bullet Options for high power and high impedance loads
SPECIFICATIONS  
bullet Sampling Rate: Selectable 100, 200, 400 microseconds
bullet Sampling Size: up to 16,455 wires
bullet Transducer Frequency Measured: up to 60 kHz standard
bullet Ultrasonic Power Measured: up to 5 Watts
bullet Compatibility: most commercial wire bonders
bullet Requirements: Windows 3.X or higher, 8 MB RAM, 1 MB Hard disk for program space
 

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Last modified: 2016-08-22