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UTHE GENERATORS

The design of every Uthe generator focuses on the metallurgical nature of wire bonding. With it's field proven Frequency Control Module, Uthe generators provide users with the flexibility and versatility demanded by today's bonding processes.

MODEL 10G, 20G, 40G, 50G GENERATORS  

With power outputs of 1, 5, 20, 40, and 50 watts, this family of generators use the same Frequency Control Module as the standard 10G. These generators are used for heavy wire bonding of power devices, single point TAB applications, flip-chip bonding and die attach. When used with Uthe's 8 crystal transducers, users can accommodate wire sizes from 4 to 20 mil.

G-SERIES SPECIFICATION AND OPTION 
Go to the G-SERIES specification and option page
MODEL 10H GENERATOR   CUSTOMIZED GENERATORS  

The model 10H generator represents Uthe's commitment to develop advanced, high quality, cost-efficient products that meet the demanding requirements of the semiconductor industry. Its dual processor design provides the 10H with a form of artificial intelligence for active control during the bonding process. Every bonding application will benefit from the new features of this generators:

The following generators are customized versions of the Model 10G generator. (consult first with Uthe)
bullet Model 10KS, Used on Kulicke and Soffa's 1471 and 1472 bonders
bullet Model 10AS, For use with ASM wire bonders
bullet Model 10HY, Used on Hybond bonders
bullet Model 10G - MA, For Matsushita bonders
bullet Model 10 - SMH, For use with Shin Me Hua bonders
bullet Model 10H Generator
bullet Model VME Generator
bullet Automatic impedance sensingr
bullet One touch power calibration
bullet Automatic power adjustment during bonding
bullet Real-time frequency, impedance, power and phase measurement
bullet Dynamic frequency control module
bullet Selectable power ramping profile
bullet High frequency option

 

H-SERIES SPECIFICATION AND OPTION    VME-SERIES SPECIFICATION AND OPTION 
Go to the H-SERIES specification and option page Go to the VME-SERIES specification and option page
GENERATORS SUMMARY
Type

Max. Output
Power*

Max. Bond
Time
Freq.
Range
Interface Control Dimensions
Low
[W]
High
[W]
Short
[mSec]
Long
[mSec]
[kHz] Bond Time Bond Power Height
[inch]
Width
[inch]
Depth
[inch]
10G

1.0

5.0

100.0

1000.0

55-139 - 82,JS,RS

- 82,JS,RS

2.75 10.00 9.00
20G 2.0 20.0 100.0 1000.0 55-65 JS,RS

JS,RS

4.00 12.00 12.00
40G 2.0

40.0

100.0

1000.0

55-65 JS,RS

JS,RS

4.00 12.00 12.00
50G 2.0 50.0 100.0 1000.0 55-65 JS,RS

JS,RS

4.00 12.00 12.00
10H-P2* 1.0

2.5

Interface Contr.

55-165 8-bit parallel 

8-bit parallel 

2.5  9  7.5 
10KS 1.0

2.5

Interface Contr.

55-65 K&S Bus

K&S Bus

Board Level: K&S
10HY 1.0

2.5

Interface Contr.

55-139 Hybond Bus 

Hybond Bus

Board Level: Hybond
P2-VME** - 2.5

Interface Contr.

25-300 VME bus

VME bus

Board Level: VME 6U,
2-slots
P2-PCI** -

2.5

Interface Contr.

25-300

PCI Bus

PCI Bus

Board Level: PCI Half Size, 1-slot
* Rear Panel Switch, ** External Supply Needed

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Last modified: 2016-08-22