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RSO-200 REFLOW

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UNITEMP GMBH.

RSO-200 REFLOW SOLDER SYSTEM 

The RSO-200 Reflow Solder System is an excellent tool for various semiconductor up to 200 mm x 170 mm substrate. Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes , prototype research, environmental research purposes and for small pre- series or series.

PROCESS GASES 

The RSO-200 can be used with standard process gasses , like Nitrogen, Oxygen, Forming Gas. The chamber is sealed and can easily be cleaned.

FLOW METER 

One gas line with Mass Flow Controller (MFC) for Nitrogen (5 slm) is default, three more gas lines (Option: MFC) are possible.

TEMPERATURE AND TEMPERATURE DISTRIBUTION 

The maximal achievable temperature is 650 C . Key features are precisely controlled fast ramp-up (75 K/sec) and excellent ramp-down rates (depending on temperature and load). The RSO-200 allows for an excellent temperature distribution and homogeneity. A graphite susceptor is included by default (ramp-up rate limited to 10 K/min).

PROGRAMMING 

The RSO-200 is equipped with a 7" touch panel which allows easy and comfortable programming directly on the unit.

COOLING 

The cooling of the parts in the quartz chamber is realized by Nitrogen gas which will be led through the chamber. For cooling of the chamber housing cooling we recommend a closed loop water cooling system (see accessories, WC-III).

SAFETY 

An interlock function as well as an Emergency-OFF-Button (EMO) are default safety functions.

DUAL CHAMBER OPTION  

This oven can also be ordered as *double chamber oven. By adding a second process chamber (Option: PC-200), the oven will have 2 process chambers and but only one controller unit. This saves money when 2 different processes are required and the chambers do not need not be cleaned due to contamination or other issues.

TECHNICAL DATA  

UniTemp RSO-200 Reflow Soldering System

UniTemp RSO-200 Reflow Soldering System

bullet

Loading area (max. part size): 200x170x40mm (WxDxH)

bullet

Quartz glass process chamber (fix mounted)

bullet with integrated gas- in- and outlet
bullet 1 Mass Flow Controller for Nitrogen 5 nlm (=norm liter per minute) is standard
bullet

heated by 18 Infrared lamps (18kW)

bullet

bottom heating

bullet

vacuum for external pump system (up to 10exp.-3 hPa, optional RSO-200-HV up to 10exp-6 hPa)

bullet

SPS controller, SIMATIC

bullet

7" Touch Panel for comfortable programming and process control

bullet

2 programs storable

bullet

Ethernet interface

bullet

Max. Temperature: 650 C

bullet

Ramp up rate: better 75 K/Sec
Ramp down rate: T=600C to 400C max. 200 K/min T=400C to 100C max. 30K/min

bullet Temperature control by thermocouple
bullet Cooling: Water cooling required (option)
bullet Electrical connection: CEE 3 x 32 A, 230V, 3 Phase
bullet Weight: about 55 kg
bullet Dimension: 505mm x 504mm x 460mm
DATA SHEET  
Get the RSO-200 Datasheet in UniTemp RSO-200 Reflow Soldering System.
INFORMATION   COMPARISON SHEETS  
  Get the RSS Comparison Sheet Comparison RSS Reflow Solder Systems
Get the Customer Specific Ovens UniTemp Customer Special Ovens
OPTIONS AND ACCESSORIES 

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RSO-MFC Mass Flow controller (max. 2 pcs.)

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RSO-FA Formic Acid Option

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RSO-GT Graphite tray with cover

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RSO-LP Laptop with preinstalled UniSoft Software

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RSO-H2 Module for using 100% Hydrogen including one mass flow controller

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RSO-H2S Safety device to prevent uncontrolled emission of Hydrogen

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RSO-PC-200 add. 200mm oven chamber ("double-chamber oven")

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RSO-PC-300 add. 300mm oven chamber ("double-chamber oven")

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RSO-TC additional thermocouple to measure on device (plugged in chamber)

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WC III: Closed loop water cooling system

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MP Membrane pump for vacuum up to 10 mbar with manometer

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MPC Chemical Membrane pump for vacuum up to 10 mbar with manometer

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RVP Rotary vane pump for vacuum up to 10exp.-3 hPa

RSO-200-HV HIGH VACUUM 

The RSO-200-HV High Vacuum Reflow Solder System is an excellent tool for various semiconductor up to 200 mm x 170 mm substrate. Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes , prototype research, environmental research purposes and for small pre- series or series.

PROCESS GASES 

The RSO-200-HV can be used with standard process gasses , like Nitrogen, Oxygen, Forming Gas. The chamber is sealed and can easily be cleaned.

FLOW METER 

One gas line with Mass Flow Controller (MFC) for Nitrogen (5 slm) is default, three more gas lines (Option: MFC) are possible.

TEMPERATURE AND TEMPERATURE DISTRIBUTION 

The maximal achievable temperature is 650 C . Key features are precisely controlled fast ramp-up (75 K/sec) and excellent ramp-down rates (depending on temperature and load). The RSO-200-HV allows for an excellent temperature distribution and homogeneity. A graphite susceptor is included by default (ramp-up rate limited to 10 K/min).

PROGRAMMING 

The RSO-200-HV is equipped with a 7" touch panel which allows easy and comfortable programming directly on the unit.

COOLING 

The cooling of the parts in the quartz chamber is realized by Nitrogen gas which will be led through the chamber. For cooling of the chamber housing cooling we recommend a closed loop water cooling system (see accessories, WC-III).

SAFETY 

An interlock function as well as an Emergency-OFF-Button (EMO) are default safety functions.

DUAL CHAMBER OPTION  

This oven can also be ordered as *double chamber oven. By adding a second process chamber (Option: PC-200), the oven will have 2 process chambers and but only one controller unit. This saves money when 2 different processes are required and the chambers do not need not be cleaned due to contamination or other issues.

TECHNICAL DATA  

UniTemp RSO-200-HV High Vacuum Reflow Soldering System

UniTemp RSO-200-HV High Vacuum Reflow Soldering System

bullet

Loading area (max. part size): 200x170x40mm (WxDxH)

bullet

Quartz glass process chamber (fix mounted)

bullet with integrated gas- in- and outlet
bullet 1 Mass Flow Controller for Nitrogen 5 nlm (=norm liter per minute) is standard
bullet

heated by 18 Infrared lamps (18kW)

bullet

bottom heating

bullet

vacuum up to 10exp-6 hPa (Turbomolecular and vacuum measurement included),

bullet

SPS controller, SIMATIC

bullet

7" Touch Panel for comfortable programming and process control

bullet

12 programs storable

bullet

Ethernet interface

bullet

Max. Temperature: 650 C

bullet

Ramp up rate: better 75 K/Sec
Ramp down rate: T=600C to 400C max. 200 K/min T=400C to 100C max. 30K/min

bullet Temperature control by thermocouple
bullet Cooling: Water cooling required (option)
bullet Electrical connection: CEE 3 x 32 A, 230V, 3 Phase
bullet Weight: about 65 kg
bullet Dimension: 505mm x 504mm x 580mm
DATA SHEET  
Get the RSO-200-HV Datasheet in UniTemp RSO-200 High Vacuum Reflow Soldering System.
OPTIONS AND ACCESSORIES 

bullet

RSO-MFC Mass Flow controller (max. 2 pcs.)

bullet

RSO-FA Formic Acid Option

bullet

RSO-GT Graphite tray with cover

bullet

RSO-LP Laptop with preinstalled UniSoft Software

bullet

RSO-H2 Module for using 100% Hydrogen including one mass flow controller

bullet

RSO-H2S Safety device to prevent uncontrolled emission of Hydrogen

bullet

RSO-PC-200 add. 200mm oven chamber ("double-chamber oven")

bullet

RSO-PC-300 add. 300mm oven chamber ("double-chamber oven")

bullet

RSO-TC additional thermocouple to measure on device (plugged in chamber)

bullet

WC III: Closed loop water cooling system

bullet

MP Membrane pump for vacuum up to 10 mbar with manometer

bullet

MPC Chemical Membrane pump for vacuum up to 10 mbar with manometer

bullet

RVP Rotary vane pump for vacuum up to 10exp.-3 hPa

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Last modified: 2016-08-22