HOME ] UP ] FEEDBACK ] CONTENTS ] SEARCH ]
RSS-3X210 SYSTEM

2 ZONE VACUUM SEALER ] RTP-100 SERIES OVENS ] RTP-150 SERIES OVENS ] VPO-1000-300 VACUUM PROC. ] RSO-200 REFLOW ] [ RSS-3X210 SYSTEM ] RSS-110-160-310 REFLOW ] VSS-450-300 VACUUM REFL. ] HOT CHUCK/ WORKSTAGES ] HOT PLATES/ WORKSTAGES ] ACCESSORIES ]
SITE LINKS

 

 

UNITEMP GMBH.

RSS-3X210 REFLOW SOLDER SYSTEM 

The RSS-3X210 Reflow Solder System is an excellent tool for various solder processes up to 100 mm diameter wafer (12 pcs in one run). Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series.

PROCESS GASES 

Beside standard process gases, like Nitrogen, Oxygen, Forming Gas the system can also be used with pure Hydrogen (Option: H2 and H2S). The chamber is sealed and can easily be cleaned.

FLOW METER 

One gas line with Flow Meter (FM-EL) (manually operated with digital display) is default, one more gas line (Option: FM-EL) is possible. Also a Mass Flow Controller can be choosen.

VACUUM 

The system is vacuum capable up to 10-3 hPa.

TEMPERATURE AND TEMPERATURE DISTRIBUTION 

The maximal achievable temperature is 300 C . The hot plate allows an excellent temperature distribution and homogeneity.

PROGRAMMING 

The RSS-3X210 is equipped with a Eurotherm 2604 precision temperature controller which allows the programming directly on the unit or by using the USB interface and comfortable programming on a PC. It is possible store 20 programs with 100 steps each.

COOLING 

The hot plate is active cooled. For chamber housing cooling an external cooling is required (we recommend a chiller, Accessories, WC-I)

GENERAL 

The chamber is hermetically sealed with a viewing-window which allows observation of the process during soldering. Two program controlled gas lines with flow meters allow use of two different gases, either Nitrogen or forming gas. By connecting to an external pump the furnace is made vacuum capable. An economical & compact unit as table top version perfect for:

bullet flux-less soldering
bullet flip chip process
bullet adhesive bonding
bullet hermetical sealing under controlled atmosphere
bullet solder bump reflowing
bullet encapsulation of housings
bullet soldering of power devices
bullet heat treatment of semiconductor wafers
bullet prototype research
bullet quality control and environmental research
TECHNICAL DATA  

UniTemp RSS-3X210 Reflow Soldering System

UniTemp RSS-3X210 Reflow Soldering System

bullet

heated area:  630 mm x 210 mm

bullet

for up to 12 Wafer each 100mm dia with lift pins

bullet vacuum atmosphere up to 10-3 mbar
bullet temperature up to 300 C
bullet ramp up rate: up to 120 K/min
bullet

ramp down rate: up to 60 K/min

bullet

integrated controller (100 segments are programmable)

bullet

USB interface incl. software UniSoft

bullet

1 gas line with manual adjustable flow meter and digital display is default

bullet

up to 4 gas lines

bullet

water cooling required

bullet

Dimensions: 820 x 630 x 315 mm

bullet

Weight: about 100 kg

bullet electrical connect: 3x32 A CEE plug, 230 V, 18 kW
DATA SHEET  
Get the RSS-3X210 Datasheet in UniTemp RSS-3X210 Reflow Soldering System.
INFORMATION   COMPARISON SHEETS  
  Get the RSS Comparison Sheet Comparison RSS Reflow Solder Systems
Get the Customer Specific Ovens UniTemp Customer Special Ovens
OPTIONS AND ACCESSORIES 

bullet

RSS-FA Formic Acid Module

bullet

RSS-FM-EL Additional gas line with flow meter and digital display

bullet

RSS-MFC Additional gas line with Mass Flow Controller (max. 2)

bullet

RSS-H2 Hydrogen Module to use 100% Hydrogen

bullet

RSS-H2S Safety device to prevent uncontrolled emission of Hydrogen

bullet

RSS-IL Interlock mechanism during operation

bullet

RSS-TC Additional thermocouple (max. 6 pcs) to measure on device; for external measurement tool

bullet

RSS-VM Vacuum measurement with data logging

bullet

WC II Closed loop water cooling system

bullet

MP Membrane (diaphragm) pump for vacuum up to 10 mbar with manometer

bullet

MPC Chemical resistant membrane (diaphragm) pump for vacuum up to 10 mbar with manometer

bullet

RVP Rotary vane pump for vacuum up to 10-3 mbar with oil filter and manometer

HOME ] UP ]
Send mail to info@bita.se with questions or comments about this web site.
Copyright 1998 BITA ELEKTRONIK SVENSKA AB 
Last modified: 2016-08-22