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VPO-1000-300 VACUUM PROC.

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UNITEMP GMBH.

VPO-100-300 VACUUM PROCESS OVEN  TOP LOADING 

Vacuum Process Oven for up to 320 x 320 mm substrate size and temperature up to 1000 C. Lamp heated rapid thermal annealing RTA and rapid thermal processing RTP equipment are using lamp heating in order to ramp up and cool down semiconductor wafers pretty fast. This equipment is therefore mainly used for applications where the substrate needs to be brought to a certain temperature just only for short time. The high ramp rates allow a short overall process time and keep the thermal budget (this is the total time of a wafer, being exposed to high temperature) of the wafer low. Because of the design of the heaters, these RTA and RTP tools are used mainly for single wafer treatment. Wafers have to be treated one by one. This is not as important as for other batch thermal processes, which use vertical furnaces and horizontal furnaces, because the process time is very short anyway. However wafer handling takes a substantial part of process time.

UniTemp RTP furnaces offer a unique lamp arrangement with upper and lower cross lamp arrays. The temperature distribution tool provides outstanding and unparalleled temperature uniformity resulting in process repeatability.

APPLICATIONS 

Perfect for wafer up to 300 mm, 4 pcs 156 mm solar cells or substrates up to 300 x 300 mm. Through the chamber walls there can be led different feed troughs, like window for opticall measurement tools, thermocouple feed through, gas inlets, etc.. The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa..

MOST FEASABLE APPLICATIONS 

Perfect for wafer up to 300 mm, 4 pcs 156 mm solar cells or substrates up to 300 x 300 mm. Through the chamber walls there can be led different feed troughs, like window for opticall measurement tools, thermocouple feed through, gas inlets, etc.. The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa..

bullet Annealing processes
bullet Rapid Thermal Processes
bullet SiAu, SiAl, SiMo alloying
bullet low k dielectrics
bullet post implanting annealing
TECHNICAL DATA  

VPO-1000-300 VACUUM PROCESS OVEN - TOP LOADING

VPO-1000-300 VACUUM PROCESS OVEN - TOP LOADING

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Chamber size: 350 x 350 x 50 mm

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Loading area: 320 x 320 x 50 mm (optional, chamber height 120 mm)

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Chamber walls: Aluminum polished, easy to clean (optional, stainless steel)

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Cover: opens and closed vertically (top loader)

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Direct or remote control  for automatically application on request (SPS, robotics, etc).

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Bottom heating: 2 x 24 lamps crossed 21 kW

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Upper heating:   2 x 24 lamps crossed 21 kW (selectable)

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Chamber: Gas N2

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Control: SIMATIC  SPS  with touch panel 7"

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1 Mass Flow controller for 5 nlm (=norm liter per minute) is standard

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Optional: up to max. 4 gas lines

bullet Optional: MP (Membrane pump): 10  hPa. Monitored by manometer.
bullet Optional: RVP (Rotary vane pump):  10exp.-3 hPa. Vacuum sensor up to 10exp.-3 hPa
bullet Power supply: 2 x [CEE 3 x 32 A / 3~ +N+ PE, 230 V].
bullet Vacuum connector: KF 16
bullet Exhaust: KF16 rear site
bullet Cooling water supply: 10 mm hose
bullet Feed thorough: 2 x DN 16
bullet Dimension: 505 x 504 xx 780 mm (WxDxH)
bullet Weight: about 100 kg
DATA SHEET  
Get the VPO-1000-300 Datasheet in UniTemp VPO-1000-300 Terminal Process Oven.
INFORMATION   COMPARISON SHEETS  
  Get the RTP Comparison Sheet Comparison RPT ovens
Get the Customer Specific Ovens UniTemp Customer Special Ovens
OPTIONS AND ACCESSORIES 

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VPO-MFC Mass Flow controller (max. 2 pcs.)

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VPO-MP Membrane (Diaphragm) pump up to 10 hPa with manometer

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VPO-RVP Rotary vane pump for vacuum up to 10exp.-3 hPa with oil filter and manometer monitoring

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VPO-SS Chamber made  of stainless steel  instead of Alu (polished) 50 mm

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VPO-GP Graphite Plate 3 mm thick

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VPO-QP Quartz plate for separation of the top lamp area

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VPO-QH Quartz universal holder for 100 mm up to 300 mm wafer size (star)

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VPO-TC additional thermocouple to measure on device (plugged in chamber); for external measurement tool max. 4 pcs

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VPO-VM Vacuum measurement with data logging, up to 10exp.-3 hPa

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WC III: Closed loop water cooling system

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Last modified: 2016-08-22