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VSS-450-300 VACUUM REFL.

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UNITEMP GMBH.

VSS-450-300 VACUUM REFLOW SOLDER SYSTEM 

The VSS-450-300 Vacuum Reflow Solder System is an excellent tool for various solder processes up to 300 mm diameter wafer or 300 mm x 300 mm substrate size and 50 mm height (Option: EH with 120 mm height). Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series.

PROCESS GASES 

Beside standard process gases, like Nitrogen, Oxygen, Forming Gas the system can also be used with pure Hydrogen (Option: H2 and H2S). The chamber is sealed and can easily be cleaned.

FLOW METER 

One gas line with Mass Flow Controller (MFC) for Nitrogen 5 slm (=norm liter per minute) is default, three more gas lines (Option: MFC) are possible.

VACUUM 

The system is vacuum capable up to 10-3 hPa.

TEMPERATURE AND TEMPERATURE DISTRIBUTION 

The maximal achievable temperature is 450 C . The hot plate allows an excellent temperature distribution and homogeneity.

PROGRAMMING 

The VSS-450-300 is equipped SIMATIC SPS controller and a 7" touch panel for easy programming directly on the unit and watching the process parameter.

COOLING 

The hot plate is active cooled. For chamber housing cooling an external cooling is required (we recommend a chiller, Accessories, WC-III)

GENERAL 

Through the chamber walls there can be led different feed thorough, like window for optical measurement tools, thermocouple feed through, gas inlets, etc.. The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa.. Processes using also other contaminating processes possible and all other applications of a Reflow Solder oven are obligatory, like:

bullet Solder Reflow with and without flux
bullet Wafer bump and solder ball reflow
bullet Flip Chip
bullet Encapsulation and sealing of housings
bullet High Power LED module
bullet resistor paste firing
bullet IGBT/DBC
bullet Die attachment
TECHNICAL DATA  

UniTemp VSS-450-300 Vacuum Reflow Soldering System

UniTemp VSS-450-300 Vacuum Reflow Soldering System

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Chamber size: 350 x 350 x 50 mm (optional up to 120 mm)

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Chamber walls: Aluminum polished, easy to clean (optional: stainless steel)

bullet Cover: opens and closed vertically (top loader)
bullet Direct or remote control for automatically application (SPS, robotics, etc).
bullet Ramp up rate: 2 K/sec.
bullet Ramp down rate: 60 K/min
bullet Bottom heating: 2 x 12 lamps crossed 21 kW
bullet Cooling: by water cooled graphite plate 320 x 320 mm
bullet Control: SIMATIC SPS with touch panel 7"
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Software: process control, programming, recording and process documentation.

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1 Mass Flow controller for 5 nolm (norm liter per minute) is standard

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Optional: up to 4 gas lines

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Optional: MPC (Chemical resistant Membrane pump): 10 hPa. Monitored by manometer.

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Optional: RVP (Rotary vane pump): 10exp.-3 mbar. Vacuum sensor up to 10exp.-3 mbar

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Power supply: 1 x [CEE 3 x 32 A / 3~ +N+ PE, 230 V]. Back side.

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Vacuum connector: KF 16

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Exhaust: KF16 rear site.

bullet gas line: 4 mm OD Swagelok compression fitting
bullet Dimension: 504 x 504 x 830 mm (WxDxH)
bullet Weight: 95 kg
DATA SHEET  
Get the VSS-450-300 Datasheet in UniTemp RSS-3X210 Reflow Soldering System.
INFORMATION   COMPARISON SHEETS  
  Get the RSS Comparison Sheet Comparison RSS Reflow Solder Systems
Get the Customer Specific Ovens UniTemp Customer Special Ovens
OPTIONS AND ACCESSORIES 

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RSS-FA Formic Acid Module VSS-MFC Mass Flow Controller (max. 2 pcs)

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VSS-EH Extended chamber height up to 120 mm

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VSS-FA Formic acid module

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VSS-FT Flux trap

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VSS-H2 Module for using 100% Hydrogen including MFC

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VSS-H2S Safety device to prevent uncontrolled emission of Hydrogen

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VSS-L Lift pins

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VSS-RC Remote control for automatic application (SPS, robotics)

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VSS-TC additional thermocouple to measure on device (plugged in chamber); for external measurement tool (max. 4 pcs)

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VSS-VM Vacuum measurement with data logging, up to 10exp.-3 hPa

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MP or MPC Membrane Pump or chemical resistant membrane pump for vacuum up to 10 mbar with manometer

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RVP Rotary vane pump for vacuum up to 10exp.-3 with oil filter and manometer monitoring

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WC III Closed loop water cooling system

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Last modified: 2016-08-22