HOME ] UP ] FEEDBACK ] CONTENTS ] SEARCH ]
PureCon™ for UHV

Thermotech TE™ ] Silvertech PT-1™ Expoxy ] [ PureCon™ for UHV ] UBM™ Under Bond Metalization ] Silicon ] Sil-R™ ] Sil-X™ Optical Media Alloy ] Sil-XL™ ] EVAPro™ ] SFG™ ] ME™ ] VCT™ ] HSC™ ]
SITE LINKS

 

 

WILLIAMS Advanced Materials 

 Williams Advanced Materials

PURECON FOR UHV 

Homogenous fine grain structure for repeatable deposition throughout target life.

GENERAL 

PureCon™ materials have been engineered as a UHV materials solution for GMR thin film head production, as well as MRAM applications. PureCon™ materials have been purified to reduce the gaseous impurities to extremely low levels. At the same time, further metallic impurity reductions have also been achieved. These improvements have been implemented without sacrificing consistently fine grain size. The net result yields sputtering targets that are optimal not only for current thin film deposition equipment, but also for use in future generation UHV deposition tools.

MATERIAL DATA Purity Levels up to 99.999% 

Grain Size (Microns)

Non-Metallics

(C ppm) (O ppm) (H ppm) (N ppm)
Cu <200 <10 <20 <5 <10
Ta <100 <20 <30 <5 <10
Al <200 <10 <20 <5 <10
Ru <50 <50 <100 <5 <10
Rh <50 <50 <100 <5 <10
Co/Fe <50 <20 <10 <5 <10
Ni/Fe <50 <20 <10 <5 <10
Ni/Fe/Cr <50 <20 <100 <5 <10
Ni/Co/Fe <50 <20 <20 <5 <10
Mn/Pt <100 <300 <600 <10 <300
Mn/Ir <100 <300 <600 <10 <300

RELATED TO THIS ITEM  

+ Magnetic Data Storage
+ Metallic & Non-Metallic Sputtering Materials
+ Thin Film Manufacturing Capabilities

bullet Fine Grain Size
bullet Low Gaseous Impurities
bullet Film Uniformity Improvement
bullet P.T.F. Optimization

HOME ] UP ]
Send mail to info@bita.se with questions or comments about this web site.
Copyright © 1998 BITA ELEKTRONIK SVENSKA AB 
Last modified: 2016-08-22