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Fine
Grain Microstructural Development for Thin Film Deposition Applications.
The development of a fine grain microstructure in sputtering targets for
thin film applications is a critical factor in the efficiency and
robustness of the deposition process.This research was initiated to
produce a practical method of producing superior fine grain sputtering
targets. The SFG™ process has been developed to
achieve a consistently superior fine grain in non-ferrous metals. SFG™
targets produced from gold and silver were compared against industry
standard targets. A comprehensive examination of the grain structure was
performed to distinguish between the two microstructures. The film
deposited by these targets was also investigated. The attributes
measured include: film thickness profile, deposition rate, and film
uniformity. |
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Superior thin film for optical and other
deposition applications
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The
SFG™ process produced a
consistently finer grain size when compared against the industry
standard microstructure. The improved microstructure was observed in
both gold and silver. The sputtered thin film thickness profile was also
improved when using the SFG™
target.
In
addition, the sputter rate and the absolute difference in the thin film
were superior when the SFG™ target was utilized.
Similar results occur in other precious metals and non-ferrous alloys.
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Industry
Standard |
SFG™ |
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Using a
SFG™ target allows for a uniform erosion pattern to develop during the
sputtering process. The randomly orientated grain structure developed
eliminates any preferred sputtering of the target material. When
preferential sputtering occurs, the target erodes unevenly. This leads
to both a poorly sputtered thin film and less than optimal utilization
of the target material.
The SFG™
process produces a sputtering target that contributes to a superior thin
film for optical and other deposition applications.
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