Silicon is the
second most abundant element in nature, accounting for about 25.7% of
the earth's crust. It can be found in Group IVB of the Periodic Table.
Williams produces silicon from crystal growing techniques. The primary
sputtering techniques for silicon are, RF Sputtering and DC Magnetron.
BACKING PLATES AND BONDING
provides Molybdenum and alternative backing plate material for all major
metallizing equipment. Our state-of-the-art bonding centers are located
globally, offering standard metallic target bonding and high temperature
solder bonding for greater disc metallizing throughput. Void free solder
bonding verified by ultrasonic inspection.