High purity, low alkali
materials ensure excellent film uniformity and reduced particulation.
UBM™ grade thin
film deposition materials have been engineered to optimize performance
in wafer level packaging processes. Semiconductor companies have adopted
flip chip packaging as a low cost, high volume assembly technology
solution. UBM™ grade materials display a uniform, fine grain size that
improves overall thin film uniformity. Gaseous impurities have also been
further reduced, resulting in extremely consistent thin film electrical
properties. All of this adds up to enhanced device performance and
greater wafer yield.