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WILLIAMS Advanced Materials 

 Williams Advanced Materials

VCT 

Improved sputtering performance due to smaller grain size targets

GENERAL 



Vibration Casting of AuSn and AuGe Sputtering Targets

The development of fine grain size in PVD sputtering targets has been shown to improve the processing performance of the target in the sputtering chamber. Fine grain size is most commonly developed in a metal through the introduction of mechanical work and the addition of heat to allow recrystallization of the metal into small grains. Some alloys, due to their brittle, nature are not able to be processed by traditional metal working techniques without experiencing cracking and material failure.

A novel approach to obtaining fine grain size in PVD sputtering targets for brittle materials has been developed. Gold-Tin (AuSn) and Gold-Germanium (AuGe) are two brittle alloys formed into targets used to deposit the solder layer on the device surface. Neither of these two alloys tolerate appreciable mechanical work. AuSn and AuGe are produced at near-eutectic composition, leading to the formation of a heterogeneous microstructure.

Traditional cast targets exhibit a large varying grain size and a large eutectic structure that is detrimental to the performance of the target. A method to introduce vibration energy during casting was developed to address this problem. The energy of vibration is introduced into the molten metal leading to small grains being formed. The size of the grains formed is a function of both frequency and amplitude.

COMPARISON  PROCESS 

 

AuSn Regular Cast - 50X

 

AuSn Vibration Cast - 50X
PROCESS 

The vibrational manufacturing process develops targets that have a smaller grain size and more uniformly distribute the heterogeneous structure throughout the target. The vibrational casting process decreases the grain size from 5 mm to 0.5 mm and the eutectic structure by an order of magnitude. The smaller grain size targets produced by vibrational casting give improved performance in the chamber.

RELATED TO THIS ITEM  

+ Analytical Capabilities
+ Hybrid Micro Electronics

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