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Target Bonding

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WILLIAMS Advanced Materials 

 Williams Advanced Materials

TARGET BONDING 

Utilizing a variety of sputtered and evaporated techniques, Williams Advanced Materials offers target bonding to backing plates, enabling bonded assemblies to withstand a broad range of operating temperatures and parameters.

GENERAL 

Through our global manufacturing reach we are able to offer bonding services in Brewster NY, Santa Clara CA, Buffalo NY, Ireland, Singapore, and Taiwan.
Williams specializes in indium solder bonding of materials with highly dissimilar coefficients of thermal expansion.

WILLIAMS SUPPORTS A WIDE VARIETY OF OEM PLATFORMS 

AMAT™, Novellus™, Trikon™, Anelva™, Ulvac™, SFI™, KDF™, NEXX™, CVC™, Unaxis™, Veeco™, Singulus etc.

RELATED TO THIS ITEM  

+ Sputtering Target Recycling
+ PVD Chamber Services - PVD Shield Cleaning, Parts Cleaning, Precious Metal Recovery

Specialty bonding materials with highly dissimilar coefficients of thermal expansion.

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Last modified: 2016-08-22