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WILLIAMS ADVANCED METALS

 

Packaging Materials - Substrates Properties Chart
Material Chemical Symbol Coefficient of Thermal Expansion (ppm/K) Thermal Conductivity (W/m*K) Density (g/cc) Melting Temperature (C)
Alloy 42 NiFe 4.8 109 8.12 1426
Alumina Al2O3 6.4 30 3.91 2030
Aluminum Al 23.4 237 2.69 660
Aluminum Nitride AlN 4.5 184 3.21 2300
Beryillia BeO 6.7 281 2.91 2530
Beryllium Be 11.2 200 1.86 1287
Copper Cu 16.8 401 8.95 1083
Copper/Invar/Copper 20/60/20 5.2 18 8.4 N/A
Copper/Moly/Copper 13/74/13 5.8 185 8.89 N/A
Gallium Arsenide GaAs 6.5 47 5.26 1238
Gold Au 14.2 317 19.34 1063
Kovar NiFeCo 4.9 17 8.37 1450
Molybdenum Mo 4.9 138 10.22 2623
Nickel Ni 13.3 91 8.92 1453
Nickel/Moly/Nickel 50/90/5 5.58 132 10.09 N/A
Silicon Si 4.2 148 2.33 1410
Silicon Carbide SiC 3.7 277 3.21 2700
Silver Ag 9.6 429 10.5 962
Tungsten W 4.5 174 19.31 3380
Tungsten Copper 75W25Cu 8.3 234 14.91 N/A

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Last modified: 2016-08-22