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Low K Dielectric Sealing

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YIELD Engineering Systems Inc.

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LOW K DIELECTRIC SEALING 

Typical low-K dielectric is a porous dielectric. Unfortunately, in a standard clean room, enough moisture exists to react with the pore walls and slowly produce a moisture layer that will reduce the K factor. However, if the pores are sealed against the ingress of moisture, integrity of the dielectric can be retained.
YES equipment uses a series of vacuum pulls and hot Nitrogen purges so the sidewalls of the pores are completely dehydrated. This way, when the atmosphere of the chamber is hot Nitrogen at 1 Torr, the atmosphere in all pores is at 1 Torr.
Next, 4.7 mills of APTES are vaporized in the external vaporization chamber, and the resulting pressure of hot APTES 6 Torr fills the chamber. Every 1 Torr cavity of Nitrogen is filled with 6 Torr of hot APTES vapor.

PROCESS 

Yield Engineering Systemís YES 450PB Series

The vapor reacts with the sidewalls of the pores, creating a 5 to 20 Angstroms-thick layer that is totally hydrophobic. Not only is it hydrophobic, but the total dehydration also ensures there are no water molecules below the APTES SAM. This means the created layer cannot be destroyed with subsequent exposure to atmospheric moisture.

YES vacuum systems such as the YES-PBV300 and YES-450PB Series are designed to meet your low-k dielectric sealing needs.

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Last modified: 2017-11-09