HOME ] UP ] FEEDBACK ] CONTENTS ] SEARCH ]
Polyimide Cure

BCB cure ] Chemical Vapor Deposition ] Copper Anneal ] Copper Capping ] Descumming ] Image Reversal ] Low K Dielectric Sealing ] Organics Removal ] Photoresist Adhesion ] Photoresist Stripping ] Plasma Cleaning ] [ Polyimide Cure ] Polyimide Stripping ] Silane Coating for MEMS ] Silylation ] Wire Bond Surface Preparation ]
SITE LINKS

 

 

YIELD Engineering Systems Inc.

YES home page

POLYIMIDE CURE 

Polyimides are high temperature engineering polymers utilized by semiconductor manufacturers for their excellent mechanical, thermal, and electrical properties.

APPLICATIONS 

Yield Engineering Systemís YES 450PB Series

bullet

Adhesion promotion of molding compounds

bullet

Stress buffer coating

bullet

Protective passivation layer on top of a completed IC

bullet

Low-K separator between metal layers in ICs

bullet

Chip bonding

bullet

Interlayer dielectric

Polyimides are usually applied in liquid form and then thermally cured as a thin film or layer to achieve the desired properties. Typically, polyimides are cured in a vacuum oven so effluents can be removed.

THREE TYPES OF POLYIMIDE 
bullet

Non-photosensitive polyimide

bullet

Photosensitive, ionic type polyimide

bullet

Photosensitive, ester type polyimide

Precise temperature uniformity is essential in order to avoid cracks in the polyimide layer and color variations. Color uniformity is important for the pattern recognition systems used in assembly, and low oxygen values during this process help to achieve bright material and good adhesion.

NON-PHOTOSENSITIVE POLYIMIDE 

Non-photosensitive polyimide is less expensive and easy to handle. By-products that occur during thermal curing are liquid, so they do not quickly form hard coatings.

PHOTOSENSITIVE POLYIMIDE 

Photosensitive material achieves better process performance, including higher resolutions, wider margins in photolithography steps, and longer shelf lives. By using photosensitive polyimide, the number of process steps can be significantly reduced. Ester bond types are more stable than ionic types and have the longest shelf life. Solubility of unexposed areas is also better with ester type polyimide.

For a system specifically suited to curing polyimides, visit the YES-450PB Series product pages.

HOME ] UP ]
Send mail to info@bita.se with questions or comments about this web site.
Copyright © 1998 BITA ELEKTRONIK SVENSKA AB 
Last modified: 2016-08-22