HOME ] UP ] FEEDBACK ] CONTENTS ] SEARCH ]
YES Info

Vacuum Bake/Vapor Prime ] Image Reversal Systems ] High Temperature Cure Ovens ] Chemical Vapor Deposition ] Photoresist Strip/Descum ] Plasma Cleaning Systems ] Stainless Steel Cassettes ] Process Management Software ] [ YES Info ]
SITE LINKS
BCB cure
Chemical Vapor Deposition
Copper Anneal
Copper Capping
Descumming
Image Reversal
Low K Dielectric Sealing
Organics Removal
Photoresist Adhesion
Photoresist Stripping
Plasma Cleaning
Polyimide Cure
Polyimide Stripping
Silane Coating for MEMS
Silylation
Wire Bond Surface Preparation

 

 

YIELD Engineering Systems Inc.

YES home page

GENERAL 

Yield Engineering Systems (YES) designs process control equipment used for precise surface modification and thin film coatings. Our equipment includes high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools. almost daily, YES equipment provides the control you need to handle chemicals today and in the future.

On March 31 1998 Glen Technologies was acquired by Yield Engineering Systems (YES).  Starting at the beginning of May ‘98, the plasma cleaning product range of both companies is combined and consolidated in the Glen Technologies facilities in Fremont, California (just a 10 minute drive from the YES facilities in San Jose, CA.).  Thus the Glen location is exclusively dedicated to the engineering, manufacturing, sales and support of plasma systems. No dilution with other technologies.

APPLICATION INFORMATION 

In semiconductor fabrication, YES equipment promotes photoresist adhesion to wafers using a process that requires 99% less chemical usage over wet processes.

In MEMS packaging, YES equipment provides a hydrophobic coating to reduce stiction, the undesired static friction that wears down devices.

For bioMEMS and biosensors (lab-on-a-chip), YES equipment applies a coating that fosters biocompatibility between synthetic material and natural tissues.

For microarray processing (DNA, protein, gene, tissue, and antibody), YES equipment promotes silane/substrate adhesion using a process that uses less chemicals and facilitates higher temperature boiling for the silanes.

For nanotech applications, YES equipment can accommodate a variety of functionally diverse silanes, for a variety of processes, on a variety of surfaces. With new chemical compounds being developed almost daily, YES equipment provides the control you need to handle chemicals today and in the future.

Below we've listed some typical applications for YES equipment. Itís pretty standard for customer requirements to drive our new product development. Meeting the needs of innovative process engineers is our passion, and our business model, for more than 25 years.

  to BCB Cure   to Chemical Vapor Deposition (CVD)
  to Copper Anneal   to Copper Capping
  to  Descumming   to Image Reversal
  to Low K Dielectric Sealing   to Organics Removal
  to Photoresist Adhesion   to Photoresist Stripping
  to Plasma Cleaning   to Polyimide Cure
  to Polyimide Stripping   to Silane Coating for MEMS
  to Silylation   to Wire Bond Preparation
TECHNICAL INFORMATION 

Priming Substrates prior to Organic Coating Technical Note Priming Substrates prior to Organic Coating

Wafer Priming Batch vs. Track Technical Note Wafer Priming Batch vs. Track

Plasma & Plasma Cleaning Technical Note Plasma & Plasma Cleaning

Note 110 - The use of Plasma for Surface modification Technical Note GT 110 The use of Plasma for Surface modification

Note 115 - Chamber Design & Adhesion Strength Technical Note GT 115 Chamber Design & Adhesion Strength

Note 125 - Electron-Free Plasma for ESD samples Technical Note GT 125 Electron-Free Plasma for ESD samples

Note 210 - Low vs. High Frequency Plasma Excitation Technical Note GT 210 Low vs. High Frequency Plasma Excitation

Image Reversal of Positive Photoresists Technical Note Image Reversal of Positive Photoresists

Optimize Image Reversal of Positive Photoresists Technical Note Optimize Image Reversal of Positive Photoresists

Image Reversal Techniques with Standard Positive Photoresist Technical Note Image Reversal Techniques with Standard Positive Photoresist

Surface tension modification for Biotech Industry Technical Note Surface tension modification for Biotech Industry

Refinements of Plasma Processing Technical Note Refinements of Plasma Processing

TF1 Wafer Testing Technical Note TF1 Wafer Testing

HOME ] UP ] BCB cure ] Chemical Vapor Deposition ] Copper Anneal ] Copper Capping ] Descumming ] Image Reversal ] Low K Dielectric Sealing ] Organics Removal ] Photoresist Adhesion ] Photoresist Stripping ] Plasma Cleaning ] Polyimide Cure ] Polyimide Stripping ] Silane Coating for MEMS ] Silylation ] Wire Bond Surface Preparation ]
Send mail to info@bita.se with questions or comments about this web site.
Copyright © 1998 BITA ELEKTRONIK SVENSKA AB 
Last modified: 2016-08-22