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Image Reversal Systems

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YIELD Engineering Systems Inc.

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YES IMAGE REVERSAL SYSTEMS

The image reversal process reverses the action of positive resist so negative images can be formed with the same resolution and processing ease that a positive resist allows. Whats more, image reversal allows variations of the slope of the photoresist sidewall for higher resolution and/or lift off profiles.
YES-8TAE and YES-10TAE image reversal systems make it possible to achieve precisely defined vertical sidewall profiles.
Image Reversal This process reverses the action of positive resist so negative images can be formed with the same resolution and processing ease of positive resist.

For a system with dual function capabilities (vapor prime + image reversal), check out our enhanced YES-310TA and YES-58TA models.

BENEFITS 

YES image reversal system
  YES image reversal system

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Allows variations of the slope of the photoresist sidewall for higher resolution and improved lift off.

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Replaces use of harsh chemicals or plasma "metal etch processes.

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Using image reversal on two or more layer resist levels can eliminate residual photoresist along the sidewalls, preventing "shorts" from level to level without reducing line width.

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Image reversal done with dark or light fields eliminates standing waves; this allows steep and straight profiles, repeatable results, and excellent chemical deposition uniformity.

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Image reversal achieves excellent results for rework problems; underlying substrate is protected (for a double metal process), so unwanted metal can be stripped away without "pitting" or eroding the underlying level.

INFORMATION  
to Product Specification Chart
 
to YES Info Page
SOFTWARE OPTIONS  
to Process Management Software
TECHNICAL NOTES  

Image Reversal of Positive Photoresists Technical Note Image Reversal of Positive Photoresists
Optimize Image Reversal of Positive Photoresists Technical Note Optimize Image Reversal of Positive Photoresists
Image Reversal Techniques with Standard Positive Photoresist Technical Note Image Reversal Techniques with Standard Positive Photoresist
Surface tension modification for Biotech Industry Technical Note Surface tension modification for Biotech Industry

PROCESS  

Image Reversal reverses the action of positive resist so that negative images can be formed. This allows negative imaging with the resolution and ease of processing that positive resist allows. It also allows variations of the slope of the photo resist side wall for higher resolution and or lift off profiles.
Silylation is the chemical act of implanting a silicon rich molecule in the top layers of exposed positive photo resist. This allows deep U.V. exposure that has a small depth of focus to expose only the top layer, say the top 3,000 Angstroms of photo resist. After exposure the silylation implants silicon in the top 3,000 Angstroms. A low pressure, 5 to 10 milliliter Oxygen plasma creates a silicon dioxide layer about 50 to 200 Angstroms thick on the top of the exposed resist layer. The oxygen plasma eats the unexposed resist and the process engineer has the ability to use higher resolution deep U.V. and also have plasma developable positive resist.

 SPECIFICATION   HARDWARE 

YES-8TAE

YES-10TAE

Clean Room Compatibility

Class 10

Wafer Size

Up to 300mm

Up to 200mm

Capacity, Image Reversal

12 cassettes 100mm wafers
4 cassettes 125 or 150mm wafers
2 cassettes 300mm wafers

4 cassettes 125mm wafers
2 cassettes 125mm wafers
1 cassette  200mm wafers

Batch Throughput

1 load/hr Image Reversal

Operation Temperature

Ambient to 160C

Interior Chamber Dimensions

16"W X 18"D X 16"H

12"W X 13.25"D X 12"H

Chamber Material

316L Stainless Steel, Aluminum Door Plate

Process Gas Inputs

2

2

Cleanliness

<5 x 1 micron particles per 150mm wafer

<10 x 1 micron particles per 100mm wafer

Operation Temperature

Ambient to 160C

Process Gas Inputs

3 Standard

3 Standard, 4 Optional

 SPECIFICATION   SOFTWARE 

No. of Recipes

4 Process Recipes

 SPECIFICATION   PERFORMANCE 

Uniformity of Temperature

5C after Stabilization Period

 SPECIFICATION   HARDWARE 

YES-58TAE

YES-310TAE

Clean Room Compatibility

Class 10

Wafer Size

Up to 300mm

Up to 200mm

Capacity, Image Reversal

12 cassettes 100mm wafers

8 cassettes 125 or 150mm wafers

2 cassettes 200mm wafers

2 cassettes 300mm wafers

8 cassettes 100mm wafers

2 cassettes 150mm wafers

1 cassette 200mm wafers

Batch Throughput

2 load/hr Vacuum Bake/Vapor Prime
1 load/hr Image Reversal

Operation Temperature

Ambient to 160C

Interior Chamber Dimensions

16"W X 18"D X 16"H

12"W X 13.25"D X 12"H

Overall System Dimensions

28"W x 23"D x 32"H

23.75W x 19.5D x 27.5H

Chamber Material

316L Stainless Steel, Aluminum Door Plate

Process Gas Inputs

1 N2 vent gas, 1 ammonia, 1 vapor flask

Cleanliness

<5 x 1 micron particles per 150mm wafer

<10 x 1 micron particles per 100mm wafer

 SPECIFICATION   SOFTWARE 

No. of Recipes

4 Process Recipes

 SPECIFICATION   PERFORMANCE 

Uniformity of Temperature

5C after Stabilization Period

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Last modified: 2016-08-22