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Photoresist Strip/Descum

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YIELD Engineering Systems Inc.

YES home page

YES PLASMA PHOTORESIST STRIP/DESCUM SYSTEMS 

The YES-CV200 plasma stripping systems remove thick layers of photoresist and polyimide in the shortest amount of production time. Powerful plasma stripping "sandblasts" tough resist in an automated, user-friendly system. Or, for gentler cleaning operations, the "descum" function can be selected at the switch of a button.

Plasma cleaning technology replaces hazardous and messy wet chemical processes previously used to strip thick layers of photoresist and polyimide. Plasma stripping systems are effective for tough jobs as well gentler applications such as descumming and removing organics.

SYSTEM FEATURES 

LOW FREQUENCY 

YES systems uses capacitive plasma generation with a relatively low plasma generation frequency, 40kHz. This reduces parasitic capacitive reactance losses for more efficient plasma generation. The result is reduced chamber and product heating that can be caused by high (13.56 MHz) frequency systems.

DOWNSTREAM PROCESS  

Plasma must pass through a grounded, perforated plate to reach substrates. This grounded plate serves to balance the charge in the plasma and shield your product from damaging UV exposure. For sensitive CMOS devices, low plasma charge paired with less UV exposure significantly reduces plasma damage that may induce a CV shift is essentially zero.

TEMPERATURE CONTROL  

YES plasma strip/descum systems offer precise temperature control to achieve uniform, repeatable results.

MULTIPLE PROCESS GAS INPUTS  

YES plasma strip/descum systems come standard with four process gas connections. Mass flow controllers (MFCs) are available as an option for mixing gases.

APPLICATIONS 

YES CV200-series Plasma Photoresist Strip/Descum Systems
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Photoresist removal

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Polyimide removal

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Organics removal

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Etching

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Surface preparation

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CD master cleaning

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Descummin

BENEFITS OF PLASMA CLEANING  
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Environmentally friendly no wet chemical usage

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Higher yields

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Repeatable results

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Strip rates up to 6,000-7,000 Angstroms per minute

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Zero CV Shift

OPTIONS  
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Mass flow controllers

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Automatic downstream process control

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Data collection and analysis 

SOFTWARE OPTIONS  
  to Process Management Software
INFORMATION   SPECIFICATION SHEETS  
  Model YES-CV200RFL Technical Note YES-CV200-Series
Model YES-CV200RFS - Technical Note YES-CV200-Series
TECHNICAL NOTES  

Refinements of Plasma Processing Technical Note Refinements of Plasma Processing
TF1 Wafer Testing
Technical Note TF1 Wafer Testing

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Last modified: 2016-08-22