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Vacuum Bake/Vapor Prime

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YIELD Engineering Systems Inc.

YES home page

YES VACUUM BAKE/VAPOR PRIME SYSTEMS

The vacuum bake/vapor prime process provides a “one stop” environment for substrate dehydration and vapor deposition of hexamethyldisilizane (HMDS). YES systems give an HMDS prime layer with superior uniformity and stability.
The YES-3TA and YES-5TA models are our standard vacuum bake ovens. For increased functionality, check out these enhanced models in the TA Series:
to YES-8TAE, 10TAE (Image Reversal)
to YES-310TAE, 58TAE (Dual Function – Vapor Prime + Image Reversal)

In wafer fabrication, silane deposition is needed to promote the chemical adhesion of an organic compound (photoresist) to a non-organic substrate (wafer). The silane acts as a sort of “bridge,” with properties that will bond to both the photoresist and wafer surface. Typically, hexamethyldisilizane (HMDS) is used. Old wet processes for depositing silane generated a substantial amount of hazardous waste. Additionally, the coating only has a limited lifespan, meaning a process engineer has a small window of time to apply photoresist before the bond degrades.

BENEFITS 

YES Vacuum Bake System
  YES Vacuum Bake System

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Precise HMDS application

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More time available between process steps

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Less chemical usage

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Stable process results

INFORMATION  
to Product Specification Chart
 
to YES Info Page
SOFTWARE OPTIONS  
to Process Management Software
TECHNICAL NOTES  

Priming Substrates prior to Organic Coating Technical Note Priming Substrates prior to Organic Coating
Wafer Priming Batch vs. Track Technical Note Wafer Priming Batch vs. Track

FEATURES  

The YES Batch Systems are designed on the premise that completely drying a semiconductor wafer can take up to 20 minutes in a heated, evacuated chamber. Depending on wafer size and the system selected, YES ovens will completely dehydrate and prime up to 200-300 wafers each half hour operating cycle. 10mV electron shift in 200 Å Gate Oxide.

 SPECIFICATION   HARDWARE 

YES-3TAE

YES-5TAE

Clean Room Compatibility

Class 10

Wafer Size

Up to 200mm

Up to 200mm

Capacity, Vacuum Bake/Vapor Prime

8 cassettes 100mm wafers
2 cassettes 150mm wafers
1 cassette  200mm wafers

12 cassettes 100mm wafers
8 cassettes 125 or 150mm wafers
2 cassettes 200 or 300mm wafers

Batch Throughput

2 load/hr Vacuum Bake/Vapor Prime

Operation Temperature

Ambient to 160°C

Interior Chamber Dimensions

12"W X 13.25"D X 12"H

16"W X 18"D X 16"H

Interior Chamber Dimensions

23.75"W X 19.5"D X 27.5"H

28"W X 23"D X 32"H

Chamber Material

316L Stainless Steel, Aluminum Door Plate

Process Gas Inputs

 1 N2 vent gas, 1 vapor flask

Cleanliness

<5 x 1 micron particles/ 150mm wafer

<10 x 1 micron particles/ 100mm wafer

 SPECIFICATION   SOFTWARE 

No. of Recipes

4 Process Recipes

 SPECIFICATION   PERFORMANCE 

Uniformity of Temperature

±5°C after Stabilization Period

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Last modified: 2016-08-22